型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
ZLG7290CP | ZLG/致远 | DIP | 24+ | 36800 | 2025-08-22 | |||
XR88C681CP/28 | EXAR/艾科嘉 | DIP | 24+ | 36800 | 2025-08-22 | |||
XTR105PA | TI/德州仪器 | DIP | 24+ | 36800 | 2025-08-22 | |||
XR2211CP | 出 | DIP | 24+ | 36800 | 2025-08-22 | |||
XR1075CP | EXAR/艾科嘉 | DIP | 20+ | 15260 | 2025-08-22 | |||
YM3812 | YAMAHA/雅马哈 | DIP | 20+ | 15260 | 2025-08-22 | |||
YM3012 | YAMAHA/雅马哈 | DIP | 20+ | 15260 | 2025-08-22 | |||
YM2151 | YAMAHA/雅马哈 | DIP | 20+ | 15260 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC32MZ1024EFG144-E/PH | MICROCHIP/微芯 | QFP | 20+ | 15260 | 2025-08-22 | |||
STM32FEBKC6T6 | ST/意法 | QFP | 18+ | 5000 | 2025-08-22 | |||
STM32F103C6T6 | ST/意法 | QFP | 18+ | 5000 | 2025-08-22 | |||
STM32F030K6T6 | ST/意法 | QFP | 18+ | 1000 | 2025-08-22 | |||
STM32G070RBT6 | ST/意法 | QFP | 20+ | 15260 | 2025-08-22 | |||
STM32G070CBT6 | ST/意法 | QFP | 20+ | 15260 | 2025-08-22 | |||
ADSP-21375KSWZ-2B | ADI/亚德诺 | QFP | 24+ | 20 | 2025-08-22 | |||
STM32G030C8T6 | ST/意法 | QFP | 20+ | 15260 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
YM3812 | YAMAHA/雅马哈 | DIP | 20+ | 15260 | 2025-08-22 | |||
S3F9498XZZ-AO98 | SAMSUNG/三星 | DIP | 18+ | 5000 | 2025-08-22 | |||
R5F212L4SNFP | RENESAS/瑞萨 | QFP | 20+ | 15260 | 2025-08-22 | |||
S9S08DZ60MLF | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
S9S08DZ60MLH | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
S9S08DZ32CLH | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
S9S08DZ60MLC | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
S9S08DZ128MLH | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
PIC16F72-I/SP | MICROCHIP/微芯 | DIP | 24+ | 36800 | 2025-08-22 | |||
PIC16F946-I/PT | MICROCHIP/微芯 | QFP | 24+ | 36800 | 2025-08-22 | |||
PIC18F46K22-I/PT | MICROCHIP/微芯 | QFP | 24+ | 36800 | 2025-08-22 | |||
PIC18F45K20-I/PT | MICROCHIP/微芯 | QFP | 24+ | 36800 | 2025-08-22 | |||
S9S08DZ60F2MLF | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
STM8S105C4T6 | ST/意法 | QFP | 18+ | 2000 | 2025-08-22 | |||
STM8S207C8T6 | ST/意法 | QFP | 20+ | 15260 | 2025-08-22 | |||
STM8S007C8T6 | ST/意法 | QFP | 20+ | 15260 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
R5F100FEA | RENESAS/瑞萨 | QFP | 20+ | 15260 | 2025-08-22 | |||
R5F212K4SNFP | RENESAS/瑞萨 | QFP | 20+ | 15260 | 2025-08-22 | |||
R5F212K4SDFP | RENESAS/瑞萨 | QFP | 24+ | 36800 | 2025-08-22 | |||
R5F212K4SNFP | RENESAS/瑞萨 | QFP | 24+ | 36800 | 2025-08-22 | |||
5895-5220C | FREESCALE/飞思卡尔 | QFP | 24+ | 100 | 2025-08-22 | |||
CD74HC154EN | TI/德州仪器 | DIP | 20+ | 15260 | 2025-08-22 | |||
ATMEGA48V-10AU | ATMEL/爱特梅尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
KM4164B-12 | SAMSUNG/三星 | DIP | 24+ | 36800 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
S9S08DZ60F1MLF | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
STM8L151F3U6 | ST/意法 | QFN | 24+ | 36800 | 2025-08-22 | |||
TDA8035HN/C1 | NXP/恩智浦 | QFN | 20+ | 15260 | 2025-08-22 | |||
TDA7703R | ST/意法 | QFP | 20+ | 15260 | 2025-08-22 | |||
UPD78F0526A | NEC/日电电子 | QFP | 20+ | 15260 | 2025-08-22 | |||
LPC1751FBD80 | NXP/恩智浦 | QFP | 24+ | 36800 | 2025-08-22 | |||
P87LPC764FN | NXP/恩智浦 | DIP | 18+ | 5000 | 2025-08-22 | |||
N79E825ADG | NUVOTON/新唐 | DIP | 18+ | 5000 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
ATF22V10C-15PU | ATMEL/爱特梅尔 | DIP | 20+ | 15260 | 2025-08-22 | |||
CD22100E | HARRIS/哈里斯 | DIP | 20+ | 15260 | 2025-08-22 | |||
M65831AP | MITSUBISHI/三菱 | DIP | 20+ | 15260 | 2025-08-22 | |||
M27C512-15F1 | ST/意法 | CDIP | 24+ | 36800 | 2025-08-22 | |||
MC9S08FL16CBM | FREESCALE/飞思卡尔 | DIP | 18+ | 5000 | 2025-08-22 | |||
PALCE16V8H-25PC/4 | ADVANCED MICRO DEVICES | DIP | 20+ | 15260 | 2025-08-22 | |||
PALCE20V8H-25PC/4 | ADVANCED MICRO DEVICES | DIP | 20+ | 15260 | 2025-08-22 | |||
PALCE22V10H-25PC/4 | ADVANCED MICRO DEVICES | DIP | 20+ | 15260 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
S9S08DZ96MLH | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
KA3525A | FAIRCHILD/仙童 | DIP | 20+ | 15260 | 2025-08-22 | |||
TCA785P | INFINEON/英飞凌 | DIP | 24+ | 36800 | 2025-08-22 | |||
TPS61020DRCR | TI/德州仪器 | QFN | 24+ | 36800 | 2025-08-22 | |||
TPS61029DRCR | TI/德州仪器 | QFN | 24+ | 36800 | 2025-08-22 | |||
TPS61027DRCR | TI/德州仪器 | QFN | 24+ | 36800 | 2025-08-22 | |||
P89LPC922FN | NXP/恩智浦 | DIP | 18+ | 1000 | 2025-08-22 | |||
MP2451DT-LF-Z | MPS/美国芯源 | SOT23-6 | 20+ | 15260 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
SAA1029BBC | PHILIPS/飞利浦 | DIP | 24+ | 36800 | 2025-08-22 | |||
ATMEGA48-20AU | ATMEL/爱特梅尔 | QFP | 24+ | 36800 | 2025-08-22 | |||
STM8L151K6U6TR | ST/意法 | QFN | 24+ | 36800 | 2025-08-22 | |||
STM8L151R8T6 | ST/意法 | QFP | 24+ | 36800 | 2025-08-22 | |||
STC15F2K16S2-28I-SKDIP28 | STC/宏晶 | DIP | 24+ | 36800 | 2025-08-22 | |||
STC15F2K60S2-28I-SKDIP28 | STC/宏晶 | DIP | 24+ | 36800 | 2025-08-22 | |||
LPC1759FBD80 | NXP/恩智浦 | QFP | 24+ | 36800 | 2025-08-22 | |||
H26M41204HPR | SKHYNIX/海力士 | BGA | 24+ | 36800 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
LFE2M70E-6FN1152I | LATTICE/莱迪斯 | 1152-BBGA | 24+ | 32800 | 2025-08-22 | |||
LFE2M70E-6FN1152C | LATTICE/莱迪斯 | 1152-BBGA | 24+ | 32800 | 2025-08-22 | |||
LFE2M70E-6F900I | LATTICE/莱迪斯 | 900-BBGA | 24+ | 32800 | 2025-08-22 | |||
LFE2M70E-6F900C | LATTICE/莱迪斯 | 900-BBGA | 24+ | 32800 | 2025-08-22 | |||
LFE2M70E-5FN900I | LATTICE/莱迪斯 | 900-BBGA | 24+ | 32800 | 2025-08-22 | |||
LFE2M70E-5FN900C | LATTICE/莱迪斯 | 900-BBGA | 24+ | 32800 | 2025-08-22 | |||
LFE2M70E-5FN1152I | LATTICE/莱迪斯 | 1152-BBGA | 24+ | 32800 | 2025-08-22 | |||
LFE2M70E-5FN1152C | LATTICE/莱迪斯 | 1152-BBGA | 24+ | 32800 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
TLC279CN | TI/德州仪器 | DIP14 | 1388 | 2025-08-22 | ||||
TLC354 | TI/德州仪器 | DIP-14 | 1388 | 2025-08-22 | ||||
TLC542CN | TI/德州仪器 | DIP20 | 1388 | 2025-08-22 | ||||
TLE4205 | SIEMENS/西门子 | DIP18 | 1388 | 2025-08-22 | ||||
TLE4216 | SIEMENS/西门子 | DIP20 | 1388 | 2025-08-22 | ||||
TLE4727 | SIEMENS/西门子 | DIP20 | 1388 | 2025-08-22 | ||||
TMM2018D-45 | TOSHIBA/东芝 | CDIP24 | 1388 | 2025-08-22 | ||||
TMS9902 | TI/德州仪器 | DIP18 | 1388 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
SN74LS158N | TI/德州仪器 | DIP | 1200 | 2025-08-22 | ||||
SN74LS161AN | TI/德州仪器 | DIP | 6800 | 2025-08-22 | ||||
SN74LS164N | TI/德州仪器 | DIP | 18000 | 2025-08-22 | ||||
SN74LS368AN | TI/德州仪器 | DIP | 3550 | 2025-08-22 | ||||
PT2262 | PTC/普诚 | DIP-18 | 1388 | 2025-08-22 | ||||
PT2264 | PTC/普诚 | DIP-18 | 1388 | 2025-08-22 | ||||
PT2272-L4 | PTC/普诚 | DIP-18 | 1388 | 2025-08-22 | ||||
PT2272-M4 | PTC/普诚 | DIP-18 | 1388 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
M5832 | OKI/日冲 | DIP18 | 1251 | 2025-08-22 | ||||
M62352 | MITSUBISHI/三菱 | DIP-20 | 452 | 2025-08-22 | ||||
M6242B | OKI/日冲 | DIP18 | 88 | 2025-08-22 | ||||
MAX110BCPE | MAXIM/美信 | DIP16 | 152 | 2025-08-22 | ||||
MAX220CPE | MAXIM/美信 | DIP16 | 100 | 2025-08-22 | ||||
MAX233CPP | MAXIM/美信 | DIP20 | 500 | 2025-08-22 | ||||
MAX236CNG | MAXIM/美信 | DIP24 | 150 | 2025-08-22 | ||||
MAX237CNG | MAXIM/美信 | DIP24 | 1000 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MAX207CNG | MAXIM/美信 | DIP24 | 154 | 2025-08-22 | ||||
MAX218CPP | MAXIM/美信 | DIP20 | 154 | 2025-08-22 | ||||
MAX222CPN | MAXIM/美信 | DIP18 | 300 | 2025-08-22 | ||||
MAX234CPE | MAXIM/美信 | DIP16 | 300 | 2025-08-22 | ||||
MAX238CNG | MAXIM/美信 | DIP24 | 1200 | 2025-08-22 | ||||
MAX250CPD | MAXIM/美信 | DIP14 | 156 | 2025-08-22 | ||||
MAX251CPD | MAXIM/美信 | DIP14 | 158 | 2025-08-22 | ||||
LFEC3E-3QN208C | LATTICE/莱迪斯 | 208-BFQFP | 24+ | 32800 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
DAC8800FP | ADI/亚德诺 | DIP20 | 1500 | 2025-08-22 | ||||
FZL4141 | SIEMENS/西门子 | DIP18 | 800 | 2025-08-22 | ||||
FZH115B | SIEMENS/西门子 | DIP16 | 400 | 2025-08-22 | ||||
ICE40LP1K-QN84 | LATTICE/莱迪斯 | 84-VFQFNDualRowsExpo | 24+ | 32800 | 2025-08-22 | |||
MB3770 | FUJITSU/富士通 | DIP16 | 154 | 2025-08-22 | ||||
MAX8213ACPE | MAXIM/美信 | DIP16 | 132 | 2025-08-22 | ||||
MAX800MCPE | MAXIM/美信 | DIP16 | 154 | 2025-08-22 | ||||
P89LPC922FN | NXP/恩智浦 | DIP | 1000 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
INA116PA | BURR-BROWN | DIP16 | 88 | 2025-08-22 | ||||
INA110KP | BURR-BROWN | DIP16 | 44 | 2025-08-22 | ||||
INA103KP | BURR-BROWN | DIP16 | 66 | 2025-08-22 | ||||
MAX421CPD | MAXIM/美信 | DIP16 | 481 | 2025-08-22 | ||||
MAX419EPD | MAXIM/美信 | DIP14 | 65 | 2025-08-22 | ||||
OPA4650P | BURR-BROWN | DIP14 | 521 | 2025-08-22 | ||||
OPA4277PA | BURR-BROWN | DIP14 | 521 | 2025-08-22 | ||||
OPA4227PA | BURR-BROWN | DIP14 | 521 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
DS1259 | DALLAS SEMICONDUCTOR | DIP16 | 30 | 2025-08-22 | ||||
DM8131N | NS/美国国半 | DIP16 | 150 | 2025-08-22 | ||||
DG303ACJ | MAXIM/美信 | DIP14 | 99 | 2025-08-22 | ||||
HIP2500IP | INTERSIL | DIP14 | 88 | 2025-08-22 | ||||
HI3-508A-5 | HARRIS/哈里斯 | DIP16 | 3000 | 2025-08-22 | ||||
MC1408P8 | MOTOROLA/摩托罗拉 | DIP16 | 1211 | 2025-08-22 | ||||
MC14020BCL | MOTOROLA/摩托罗拉 | CDIP14 | 1211 | 2025-08-22 | ||||
MC14011BCL | MOTOROLA/摩托罗拉 | CDIP14 | 1211 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
DAC8012GP | ADI/亚德诺 | DIP20 | 99 | 2025-08-22 | ||||
DAC7614P | BURR-BROWN | DIP16 | 88 | 2025-08-22 | ||||
DAC1000LCN | NS/美国国半 | DIP24 | 111 | 2025-08-22 | ||||
DAC0807LCN | NS/美国国半 | DIP16 | 150 | 2025-08-22 | ||||
DAC0806LCN | NS/美国国半 | DIP16 | 800 | 2025-08-22 | ||||
DAC0801LCN | NS/美国国半 | DIP16 | 1200 | 2025-08-22 | ||||
HI3-5701K-5 | HARRIS/哈里斯 | DIP16 | 54 | 2025-08-22 | ||||
MX7824KN | MAXIM/美信 | DIP24 | 1388 | 2025-08-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
XTR106P | BURR-BROWN | DIP14 | 99 | 2025-08-22 | ||||
XTR103AP | BURR-BROWN | DIP14 | 99 | 2025-08-22 | ||||
DS3603N | NS/美国国半 | DIP-14 | 199 | 2025-08-22 | ||||
DS34C87 | NS/美国国半 | DIP-16 | 546 | 2025-08-22 | ||||
DS34C86 | NS/美国国半 | DIP-16 | 542 | 2025-08-22 | ||||
DS14C232CN | NS/美国国半 | DIP-16 | 147 | 2025-08-22 | ||||
DS1488 | DALLAS SEMICONDUCTOR | DIP-20 | 125 | 2025-08-22 | ||||
DP83910AN | NS/美国国半 | DIP | 20 | 2025-08-22 |