| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XCKU060-2FFVA1156I | XILINX/赛灵思 | BGA | 24+ | 36800 | 2026-03-01 | |||
| XR2211CP | 出 | DIP | 24+ | 36800 | 2026-03-01 | |||
| XR1075CP | EXAR/艾科嘉 | DIP | 20+ | 15260 | 2026-03-01 | |||
| YM3812 | YAMAHA/雅马哈 | DIP | 20+ | 15260 | 2026-03-01 | |||
| YM3012 | YAMAHA/雅马哈 | DIP | 20+ | 15260 | 2026-03-01 | |||
| YM2151 | YAMAHA/雅马哈 | DIP | 20+ | 15260 | 2026-03-01 | |||
| XCM-V | NEUTRIK/优曲克 | QFP | 20+ | 15260 | 2026-03-01 | |||
| XCM-K | NEUTRIK/优曲克 | QFP | 20+ | 15260 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC32MZ1024EFG144-E/PH | MICROCHIP/微芯 | QFP | 20+ | 15260 | 2026-03-01 | |||
| STM32FEBKC6T6 | ST/意法 | QFP | 18+ | 5000 | 2026-03-01 | |||
| STM32F103C6T6 | ST/意法 | QFP | 18+ | 5000 | 2026-03-01 | |||
| STM32F030K6T6 | ST/意法 | QFP | 18+ | 1000 | 2026-03-01 | |||
| STM32G070RBT6 | ST/意法 | QFP | 20+ | 15260 | 2026-03-01 | |||
| STM32G070CBT6 | ST/意法 | QFP | 20+ | 15260 | 2026-03-01 | |||
| STM32G030C8T6 | ST/意法 | QFP | 20+ | 15260 | 2026-03-01 | |||
| TMS320F28021PTT | TI/德州仪器 | QFP | 20+ | 15260 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MN3005 | PANASONIC/松下 | DIP | 24+ | 36800 | 2026-03-01 | |||
| MN3008 | PANASONIC/松下 | DIP | 24+ | 36800 | 2026-03-01 | |||
| P87LPC764BN | NXP/恩智浦 | DIP | 18+ | 5000 | 2026-03-01 | |||
| P87LPC762FN | NXP/恩智浦 | DIP | 18+ | 5000 | 2026-03-01 | |||
| P87LPC762BN | NXP/恩智浦 | DIP | 18+ | 5000 | 2026-03-01 | |||
| P87LPC767BN | NXP/恩智浦 | DIP | 18+ | 1000 | 2026-03-01 | |||
| S3F9498XZZ-AO98 | SAMSUNG/三星 | DIP | 18+ | 5000 | 2026-03-01 | |||
| ST62T01C6 | ST/意法 | DIP | 20+ | 15260 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC16F72-I/SP | MICROCHIP/微芯 | DIP | 24+ | 36800 | 2026-03-01 | |||
| PIC16F946-I/PT | MICROCHIP/微芯 | QFP | 24+ | 36800 | 2026-03-01 | |||
| PIC18F46K22-I/PT | MICROCHIP/微芯 | QFP | 24+ | 36800 | 2026-03-01 | |||
| PIC18F45K20-I/PT | MICROCHIP/微芯 | QFP | 24+ | 36800 | 2026-03-01 | |||
| S9S08DZ60F2MLF | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2026-03-01 | |||
| STM8S105C4T6 | ST/意法 | QFP | 18+ | 2000 | 2026-03-01 | |||
| STM8S207C8T6 | ST/意法 | QFP | 20+ | 15260 | 2026-03-01 | |||
| STM8S007C8T6 | ST/意法 | QFP | 20+ | 15260 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MKE02Z64VLD4 | FREESCALE/飞思卡尔 | QFP | 20+ | 15260 | 2026-03-01 | |||
| MKE02Z32VLD4 | FREESCALE/飞思卡尔 | QFP | 20+ | 15260 | 2026-03-01 | |||
| R5F100FEA | RENESAS/瑞萨 | QFP | 20+ | 15260 | 2026-03-01 | |||
| ST62T60C6 | ST/意法 | DIP | 20+ | 15260 | 2026-03-01 | |||
| R5F212K4SNFP | RENESAS/瑞萨 | QFP | 20+ | 15260 | 2026-03-01 | |||
| R5F212K4SDFP | RENESAS/瑞萨 | QFP | 24+ | 36800 | 2026-03-01 | |||
| R5F212K4SNFP | RENESAS/瑞萨 | QFP | 24+ | 36800 | 2026-03-01 | |||
| STC12C2052-35I-PDIP20 | STC/宏晶 | DIP | 24+ | 36800 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| N79E825ADG | NUVOTON/新唐 | DIP | 18+ | 5000 | 2026-03-01 | |||
| P87LPC764FN | NXP/恩智浦 | DIP | 18+ | 5000 | 2026-03-01 | |||
| S9S08DZ60F1MLF | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2026-03-01 | |||
| TDA8035HN/C1 | NXP/恩智浦 | QFN | 20+ | 15260 | 2026-03-01 | |||
| TDA7703R | ST/意法 | QFP | 20+ | 15260 | 2026-03-01 | |||
| HI3520DRQCV200 | HISILICON/海思 | QFP | 20+ | 15260 | 2026-03-01 | |||
| MCIMX6Q6AVT08AD | FREESCALE/飞思卡尔 | BGA | 20+ | 15260 | 2026-03-01 | |||
| MCIMX6S6AVM08AB | FREESCALE/飞思卡尔 | BGA | 20+ | 15260 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PALCE16V8H-25PC/4 | ADVANCED MICRO DEVICES | DIP | 20+ | 15260 | 2026-03-01 | |||
| PALCE20V8H-25PC/4 | ADVANCED MICRO DEVICES | DIP | 20+ | 15260 | 2026-03-01 | |||
| PALCE22V10H-25PC/4 | ADVANCED MICRO DEVICES | DIP | 20+ | 15260 | 2026-03-01 | |||
| PALCE16V8Q-25PC/4 | ADVANCED MICRO DEVICES | DIP | 20+ | 15260 | 2026-03-01 | |||
| DAC0804LCN | NS/美国国半 | DIP | 20+ | 15260 | 2026-03-01 | |||
| ATF22V10C-15PU | ATMEL/爱特梅尔 | DIP | 20+ | 15260 | 2026-03-01 | |||
| CD22100E | HARRIS/哈里斯 | DIP | 20+ | 15260 | 2026-03-01 | |||
| IS61C512-15N | ISSI/芯成 | DIP | 20+ | 15260 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MP2451DT-LF-Z | MPS/美国芯源 | SOT23-6 | 20+ | 15260 | 2026-03-01 | |||
| P89LPC922FN | NXP/恩智浦 | DIP | 18+ | 1000 | 2026-03-01 | |||
| S9S08DZ96MLH | FREESCALE/飞思卡尔 | QFP | 24+ | 36800 | 2026-03-01 | |||
| DCP010505DBP | TI/德州仪器 | DIP | 24+ | 36800 | 2026-03-01 | |||
| KA3525A | FAIRCHILD/仙童 | DIP | 20+ | 15260 | 2026-03-01 | |||
| TPS61020DRCR | TI/德州仪器 | QFN | 24+ | 36800 | 2026-03-01 | |||
| TPS61029DRCR | TI/德州仪器 | QFN | 24+ | 36800 | 2026-03-01 | |||
| TPS61027DRCR | TI/德州仪器 | QFN | 24+ | 36800 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SAA1029BBC | PHILIPS/飞利浦 | DIP | 24+ | 36800 | 2026-03-01 | |||
| ATMEGA48-20AU | ATMEL/爱特梅尔 | QFP | 24+ | 36800 | 2026-03-01 | |||
| H26M41204HPR | SKHYNIX/海力士 | BGA | 24+ | 36800 | 2026-03-01 | |||
| LPC1759FBD80 | NXP/恩智浦 | QFP | 24+ | 36800 | 2026-03-01 | |||
| STM8L151K6U6TR | ST/意法 | QFN | 24+ | 36800 | 2026-03-01 | |||
| STM8L151R8T6 | ST/意法 | QFP | 24+ | 36800 | 2026-03-01 | |||
| STC15F2K16S2-28I-SKDIP28 | STC/宏晶 | DIP | 24+ | 36800 | 2026-03-01 | |||
| STC15F2K60S2-28I-SKDIP28 | STC/宏晶 | DIP | 24+ | 36800 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PCD3322 | PHILIPS/飞利浦 | DIP-18 | 1388 | 2026-03-01 | ||||
| PCD3325 | PHILIPS/飞利浦 | DIP-18 | 1388 | 2026-03-01 | ||||
| PCD3326 | PHILIPS/飞利浦 | DIP-18 | 1388 | 2026-03-01 | ||||
| MM74HC154N | TI/德州仪器 | DIP | 1200 | 2026-03-01 | ||||
| PA0016 | PANASONIC/松下 | DIP | 100 | 2026-03-01 | ||||
| NE556N | ST/意法 | DIP | 5000 | 2026-03-01 | ||||
| P89LPC922FN | NXP/恩智浦 | DIP | 1000 | 2026-03-01 | ||||
| MOS8701 | MOS | DIP | 2000 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LF444 | NS/美国国半 | DIP-14 | 5566 | 2026-03-01 | ||||
| LCMXO3L-4300E-5UWG81CTR50 | LATTICE/莱迪斯 | 81-UFBGAWLCSP | 24+ | 32800 | 2026-03-01 | |||
| LCMXO3L-2100E-5UWG49CTR | LATTICE/莱迪斯 | 49-UFBGAWLCSP | 24+ | 32800 | 2026-03-01 | |||
| LCMXO2-640HC-4TG100I | LATTICE/莱迪斯 | 100-LQFP | 24+ | 32800 | 2026-03-01 | |||
| LCMXO256C-3TN100I | LATTICE/莱迪斯 | 100-LQFP | 24+ | 32800 | 2026-03-01 | |||
| LCMXO2280C-3TN100C | LATTICE/莱迪斯 | 100-LQFP | 24+ | 32800 | 2026-03-01 | |||
| LCMXO2280C-3FTN324C | LATTICE/莱迪斯 | 324-LBGA | 24+ | 32800 | 2026-03-01 | |||
| LCMXO2-256HC-4TG100I | LATTICE/莱迪斯 | 100-LQFP | 24+ | 32800 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| OR2C08A4BA256-DB | LATTICE/莱迪斯 | 256-BGA | 24+ | 32800 | 2026-03-01 | |||
| OR2C08A3S208I-DB | LATTICE/莱迪斯 | 208-BFQFP | 24+ | 32800 | 2026-03-01 | |||
| OR2C08A3M84I-D | LATTICE/莱迪斯 | 84-LCC(J-Lead) | 24+ | 32800 | 2026-03-01 | |||
| OR2C06A4T100-DB | LATTICE/莱迪斯 | 100-LQFP | 24+ | 32800 | 2026-03-01 | |||
| OR2C06A4S240-DB | LATTICE/莱迪斯 | 240-BFQFP | 24+ | 32800 | 2026-03-01 | |||
| OR2C06A4BA256-DB | LATTICE/莱迪斯 | 256-BGA | 24+ | 32800 | 2026-03-01 | |||
| OR2C04A4M84-D | LATTICE/莱迪斯 | 84-LCC(J-Lead) | 24+ | 32800 | 2026-03-01 | |||
| OR2C04A4J160-DB | LATTICE/莱迪斯 | 160-BQFP | 24+ | 32800 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT8982AE | MITEL/敏迪 | DIP16 | 1388 | 2026-03-01 | ||||
| NE529N | PHILIPS/飞利浦 | DIP14 | 1388 | 2026-03-01 | ||||
| NE565N | PHILIPS/飞利浦 | DIP14 | 1388 | 2026-03-01 | ||||
| NE590N | PHILIPS/飞利浦 | DIP16 | 1000 | 2026-03-01 | ||||
| NE592N14 | PHILIPS/飞利浦 | DIP14 | 1388 | 2026-03-01 | ||||
| NE594N | PHILIPS/飞利浦 | DIP18 | 1388 | 2026-03-01 | ||||
| OP470G | ADI/亚德诺 | DIP14 | 521 | 2026-03-01 | ||||
| OP492G | ADI/亚德诺 | DIP14 | 521 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MM74C905N | NS/美国国半 | DIP24 | 03+ | 1388 | 2026-03-01 | |||
| MM80C98N | NS/美国国半 | DIP16 | 600 | 2026-03-01 | ||||
| MPQ3906 | MOTOROLA/摩托罗拉 | DIP-14 | 1388 | 2026-03-01 | ||||
| MT8880CE | MITEL/敏迪 | DIP20 | 1000 | 2026-03-01 | ||||
| NE570N | PHILIPS/飞利浦 | DIP-16 | 1000 | 2026-03-01 | ||||
| NE571N | PHILIPS/飞利浦 | DIP-16 | 1200 | 2026-03-01 | ||||
| NE605N | PHILIPS/飞利浦 | DIP20 | 1388 | 2026-03-01 | ||||
| NJU7301 | JRC/新日本无线 | DIP16 | 1388 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NE555 | PHILIPS/飞利浦 | DIP8 | 1388 | 2026-03-01 | ||||
| NCP1653 | ONSEMI/安森美 | DIP8 | 1000 | 2026-03-01 | ||||
| P89LPC922FN | NXP/恩智浦 | DIP | 1000 | 2026-03-01 | ||||
| SN74LS121N | TI/德州仪器 | DIP | 100 | 2026-03-01 | ||||
| SSM2024 | MOTOROLA/摩托罗拉 | DUP16 | 1388 | 2026-03-01 | ||||
| SN75467N | TI/德州仪器 | DIP-16 | 1388 | 2026-03-01 | ||||
| SN75466N | TI/德州仪器 | DIP-16 | 80 | 2026-03-01 | ||||
| S5D5520D01-A0 | SAMSUNG/三星 | DIP24 | 1388 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| OPA4650P | BURR-BROWN | DIP14 | 521 | 2026-03-01 | ||||
| OPA4277PA | BURR-BROWN | DIP14 | 521 | 2026-03-01 | ||||
| OPA4227PA | BURR-BROWN | DIP14 | 521 | 2026-03-01 | ||||
| OPA27GP | BURR-BROWN | DIP8 | 521 | 2026-03-01 | ||||
| OPA227PA | BURR-BROWN | DIP14 | 521 | 2026-03-01 | ||||
| OPA2134PA | BURR-BROWN | DIP8 | 521 | 2026-03-01 | ||||
| OPA177GP | BURR-BROWN | DIP8 | 521 | 2026-03-01 | ||||
| MPQ6002 | MOTOROLA/摩托罗拉 | DIP-14 | 1388 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NJM3517D2 | JRC/新日本无线 | DIP16 | 1388 | 2026-03-01 | ||||
| NE5081N | PHILIPS/飞利浦 | DIP20 | 1388 | 2026-03-01 | ||||
| NE5080N | PHILIPS/飞利浦 | DIP16 | 1388 | 2026-03-01 | ||||
| MF8CCN | NS/美国国半 | DIP18 | 200 | 2026-03-01 | ||||
| SN74LS160N | TI/德州仪器 | DIP | 1000 | 2026-03-01 | ||||
| SN74LS86N | TI/德州仪器 | DIP | 2000 | 2026-03-01 | ||||
| SN74LS73N | TI/德州仪器 | DIP | 1000 | 2026-03-01 | ||||
| SN74LS28N | TI/德州仪器 | DIP | 1000 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MX7824KN | MAXIM/美信 | DIP24 | 1388 | 2026-03-01 | ||||
| MX7821KN | MAXIM/美信 | DIP20 | 1388 | 2026-03-01 | ||||
| MX7574JN | MAXIM/美信 | DIP18 | 1388 | 2026-03-01 | ||||
| MX7530JN | MAXIM/美信 | DIP16 | 1388 | 2026-03-01 | ||||
| PM7645HP | ADI/亚德诺 | DIP20 | 500 | 2026-03-01 | ||||
| PCM53JP-V | BURR-BROWN | DIP24 | 1388 | 2026-03-01 | ||||
| VFC110AP | BURR-BROWN | DIP16 | 1388 | 2026-03-01 | ||||
| UCC3810N | TI/德州仪器 | DIP16 | 1388 | 2026-03-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MIC4469BN | MICROCHIP/微芯 | DIP14 | 1388 | 2026-03-01 | ||||
| MIC4468CN | MICROCHIP/微芯 | DIP14 | 1388 | 2026-03-01 | ||||
| MIC4467CN | MICROCHIP/微芯 | DIP14 | 1388 | 2026-03-01 | ||||
| SN74LS47N | TI/德州仪器 | DIP | 1800 | 2026-03-01 | ||||
| SN75112N | TI/德州仪器 | DIP-14 | 1388 | 2026-03-01 | ||||
| STP08DP05 | ST/意法 | DIP-16 | 1200 | 2026-03-01 | ||||
| UC3726N | TI/德州仪器 | DIP16 | 1388 | 2026-03-01 | ||||
| UC3706N | TI/德州仪器 | DIP16 | 1388 | 2026-03-01 |